The 2023 2nd International Conference on Applied Mechanics and Advanced Materials（ICAMAM 2023）【第二届应用力学与先进材料国际学术会议（ICAMAM 2023）】will be held on January 6-8, 2023 in Changsha, China.

The conference aims to provide a platform for experts and scholars, engineers and technicians, and technology r&d personnel engaged in applied mechanics and advanced materials science to share scientific research achievements and cutting-edge technologies, strengthen academic research and discussion, and promote the industrialization cooperation of academic achievements. During the three days of the conference, experts, scholars, entrepreneurs and other relevant personnel from universities and research institutions at home and abroad are cordially invited to participate in the conference to witness the achievements and progress in this field.

  Final Paper Submission Date:October 31, 2022

  Registration Deadline: December 23, 2022

  Conference Date: January 6-8, 2023

This conference will provide an excellent opportunity for everyone involved to learn and discuss about Applied Mechanics and Advanced Materials. Prospective author are welcome to submit the full manuscript.

Topics of interest for submission include, but are not limited to:

【More Topics: http://www.icamam.com/call_for_paper】

   SUBMISSION SYSTEM(English)                        SUBMISSION SYSTEM(Chinese)

All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere. Manuscripts should follow the conference template and are subject to both review and editing.

All full paper submissions to the ICAMAM 2023 could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability.

All accepted papers of ICAMAM 2023 will be published in the conference proceedings, which will be submitted to EI Compendex, Scopus for indexing.